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Huayihai provides through hole PCB assembly for connectors, power components, and parts that require mechanical strength on the board. Assemblies are built according to customer Gerber files, BOM, and technical specifications.
Through-hole joints are completed through wave soldering, selective soldering, or manual soldering, depending on the board design and component layout.
Custom Manufacturing Only
We provide through hole PCB assembly according to customer Gerber files, BOM, and technical specifications. We do not supply ready-made or standard products.
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Item |
Specification |
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Service Type |
Through hole PCB assembly (DIP) |
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Soldering Processes |
Wave soldering, selective soldering, and manual soldering |
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Assembly Board Size |
50 × 50 mm to 900 × 600 mm (thickness 0.5–6.0 mm) |
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Component Types |
Connectors, power devices, electrolytic capacitors, relays, and other leaded parts |
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Combined Processes |
SMT + through-hole mixed assembly available |
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Inspection |
AOI, X-ray inspection where applicable |
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Electrical Testing |
Electrical testing according to project requirements |
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Files Required |
Gerber files, BOM, technical specifications |
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Lead Time |
Lead time depends on project complexity, materials, and production quantity |
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Manufacturing |
Custom production per customer requirements |
Through-hole assembly follows standardized production processes and integrates smoothly with SMT assembly for mixed-technology projects.
Key service elements include:
Through hole assembly fits boards that rely on leaded components for strength or power:
Gerber file, BOM, and specification review
Component preparation
SMT assembly (for mixed-technology boards)
Through-hole component insertion
Wave or selective soldering
AOI inspection
X-ray inspection where required
Electrical testing according to project requirements
Final inspection and shipment
Q1: Can you handle boards with both SMT and through-hole parts?
Yes, mixed technology assembly is a standard part of our workflow.
Q2: When is selective soldering used instead of wave soldering?
When heat-sensitive or tall components must be protected, or when only part of the board needs through-hole soldering.
Q3: What is the largest board you can assemble?
Up to 900 × 600 mm, with board thickness from 0.5 to 6.0 mm.
Q4: What files are required to start?
Gerber files, the BOM, technical specifications, and quantity requirements.
Q5: How is lead time determined?
3–5 working days for samples and small batches, after file review is complete.
Need through hole assemblies with reliable, strong joints?
Send us your Gerber files, BOM, and quantity for a quotation. Learn more at nexuspcba.com.
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Through Hole PCB Assembly for Wave and Selective Soldering Images |