Custom Backdrill PCB (Stub Removal)
Huayihai fabricates custom backdrilled PCBs for high-speed designs. Backdrilling removes the unused portion of a plated through-hole — the stub — after lamination, so backdrilling removes the unused portion of a plated through-hole after lamination, reducing the reflections and signal degradation caused by via stubs in high-speed channels.
Backdrilling supports cleaner impedance behavior on high-speed channels and is often specified together with controlled impedance and thick boards, where long through-holes create the largest stubs. Huayihai backdrills boards on 2 to 64 layer stack-ups with aspect ratios up to 16:1, under IPC-A-600 workmanship standards.
Custom Manufacturing Only
We fabricate backdrilled PCBs according to customer Gerber files and technical specifications. We do not supply ready-made or standard stock boards.
Product Specifications
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Item
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Specification
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Process
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Controlled-depth backdrilling of plated through-hole stubs
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Layer Count
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2 – 64 layers
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Aspect Ratio
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Up to 16:1
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Minimum Mechanical Drill
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0.1 mm
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Board Thickness
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0.2 – 17.5 mm
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Trace Width / Spacing
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3/3 mil (prototype and volume production)
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Impedance Tolerance
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Available where specified (typically ±5%)
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Max Board Size
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610 × 1100 mm
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Surface Finish
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ENIG, Im Sn, Im Ag, OSP, HASL (per customer requirement)
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Manufacturing
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Custom production per customer requirements
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Key Features
- Removal of unused via stubs after lamination
- Cleaner signal integrity on high-speed channels
- Available on 2 to 64 layer stack-ups with aspect ratios up to 16:1
- Combined with controlled impedance at ±5% tolerance
- Applied to connector and backplane style through-holes
- Manufactured under IPC-A-600 workmanship standards
Manufacturing Highlights
Backdrilling is a controlled-depth drilling step performed after plating, so the remaining stub length depends on depth control relative to the target layer. Huayihai manufactures backdrilled PCBs according to customer stack-up requirements and designated backdrill depth specifications.
Key fabrication elements include:
- Stack-up and backdrill depth scheme review
- Plated through-hole formation before backdrilling
- Controlled-depth backdrilling of designated holes
- Visual and cross-section inspection of drilled holes
- Impedance verification where high-speed channels require it
- 100% electrical testing before shipment
Typical Applications
Backdrilled PCBs serve designs where stub effects degrade high-speed signals:
- Backplanes and Connector Interfaces
- Communication and Data Transmission Equipment
- High-Speed Digital Boards
- Test and Measurement Instruments
- Industrial Control Systems
- Other High-Speed Applications
Why Choose Huayihai
- Over 20 years of PCB manufacturing experience
- Backdrilling available on stack-ups up to 16:1 aspect ratio
- Supported by ±5% impedance control capability
- Quality management based on ISO 9001, ISO 13485, IATF 16949 and UL
- IPC-A-600 workmanship standards
- Prototype, low-volume, and mass production support
Manufacturing Process
- Gerber file and stack-up review
- Lamination and plated through-hole formation
- Outer layer imaging and plating
- Controlled-depth backdrilling of designated vias
- Solder mask and surface finish
- Electrical testing and final inspection
FAQ
Q1: What does backdrilling do?
It removes the unused portion (stub) of a plated through-hole so high-speed signals pass through a cleaner path.
Q2: Which boards need backdrilling?
Typically thick, high-layer-count boards with high-speed channels in connectors and backplanes.
Q3: What aspect ratios can be backdrilled?
Stack-ups up to 16:1 aspect ratio.
Q4: Does backdrilling work with controlled impedance?
Yes, backdrilled boards are commonly built with controlled impedance at ±5% tolerance.
Q5: What is the standard lead time?
3–5 working days for PCB prototypes and batches, after file review is complete.
Q6: What information is needed for a backdrill PCB quotation?
Gerber files, stack-up information, and designated backdrill requirements help us prepare an accurate quotation.
Q7: Can backdrilling be combined with HDI?
Yes. Backdrilling can be applied to multilayer and HDI designs where specified by the customer.
Request a Quote
Need backdrilled PCBs for cleaner high-speed channels?
Send us your Gerber files and stack-up details for a quotation. Learn more at nexuspcba.com.
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Custom Backdrilled PCB Images
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